Researchers from imec and TU DELFT recently participated in the SiliconPV Conference 2025, where they presented their latest findings on the “Impact of Carrier Foil Configurations on the Reliability of TWILL Interconnection Technology .” The study specifically evaluated silicon heterojunction (SHJ) modules through thermal cycling (TC) tests, showcasing outstanding fill factor (FF) retention even after 600 cycles (3× IEC standard). These results confirm the high reliability and robustness of this innovative interconnection technology.
Stay tuned for more detailed insights and results in upcoming publications and conferences!
